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目前显示的是 七月, 2025的博文

5 Advantages To Using SMT in Your Electronic Manufacturing Project

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  The saying "bigger is better" doesn't hold true in the world of electronics, especially when it comes to surface-mount technology (SMT). SMT involves placing components directly onto the   surface of a printed circuit board   (PCB) to create a circuit. This method has become the preferred choice in the electronics industry for circuit creation. While both SMT and through-hole technology can be used on the same PCB, SMT versions of through-hole PCB designs are often available. SMT can significantly impact design and development in electronic manufacturing. Here are some advantages of using SMT in your project:     1. Small Footprint   Using surface-mount technology (SMT) for placing components on a small PCB can help maintain a compact design.  SMT components  are generally smaller than those used in through-hole technology because they have either smaller leads or no leads at all. This results in a space-saving design, occupying less than half t...

What is the SMT Process and Why Should OEMs Care?

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  What is SMT?   Surface mount technology (SMT) is the process wherein components are mounted onto the surface of a printed circuit board. The components are designed specifically to be directly mounted, rather than hardwired, onto the circuit board for the vast majority of electronics.   Surface mount technology (SMT)  has been widely adopted since the 1980s due to its automation, which saves both time and costs for manufacturers and customers. In the past, components were connected using hand wiring through holes between the boards, a process that required manual labor and was prone to human error. In contrast, the  SMT process  is not only automated but also more adaptable to future technological advancements compared to the traditional through-hole method.   SMT offers several other advantages, including higher component density, the ability to use smaller components, and better performance under stress. Additionally, SMT allows for components to b...